Publikationen

This study investigates uniaxial compression behavior of focused ion beam (FIB) manufactured [1 1 1] nickel (Ni) small-scale pillars, ranging in diameter from approximately 25 µm to below 200 nm, in order to examine the effect of crystallographic orientation on the mechanical properties. This study is unique from other micro-pillar studies in that the [1 1 1] orientation has a considerably lower Schmid factor, and has multiple slip systems available. The [1 1 1] Ni pillars show a strong increase in yield stress and work hardening with decreasing diameter. The relationship between yield stress and diameter (σy ∝d−0.69) matches well with previous small-scale pillar studies. Strain hardening, which has been inconsistently observed in other micro-pillar studies, is found to be a function of both diameter and orientation. Although the precise mechanism for hardening is unknown, transmission electron microscopy reveals dislocations throughout the pillar and into the base material suggesting that dislocation interactions and deformation below the pillar play a role in the observed strain hardening. Furthermore, a slight crystallographic rotation of the pillar is observed likely contributing to the observed mechanical properties. By exploring the role of crystallography on the plastic deformation behavior, this study provides additional insight into the nature of the size effect.

This study investigates the small-scale deformation behavior of [111], [2 10] and [00 1] NiTi shape memory alloys. In stark contrast to bulk deformation behavior, the pseudoelastic behavior of sub-micron diameter compression pillars is highly dependent on diameter and relatively independent of orientation. Transmission electron microscopy is used to investigate pillars post-compression, giving insight into the deformation mechanisms involved.

We present a systematic study of the mechanical properties of different Cu, Ta/Cu and Ta/Cu/Ta films systems. By using a novel synchrotron-based tensile testing technique isothermal stress-strain curves for films as thin as 20 nm were obtained for the first time. In addition, freestanding Cu films with a minimum thickness of 80 nm were tested by a bulge testing technique. The effects of different surface and interface conditions, film thickness and grain size were investigated over a range of film thickness up to 1 µm. It is found that the plastic response scales strongly with film thickness but the effect of the interfacial structure is smaller than expected. By considering the complete grain size distribution and a change in deformation mechanism from full to partial dislocations in the smallest grains, the scaling behavior of all film systems can be described correctly by a modified dislocation source model. The nucleation of dissociated dislocations at the grain boundaries also explains the strongly reduced strain hardening for these films.

Temperature and film thickness are expected to have an influence on the mechanical properties of thin films. However, mechanical testing of ultrathin metallic films at elevated temperatures is difficult, and few experiments have been conducted to date. Here, we present a systematic study of the mechanical properties of 80-500-nm-thick polycrystalline An films with and without SiNx passivation layers in the temperature range from 123 to 473 K. The films were tested by a novel synchrotron-based tensile testing technique. Pure Au films showed strong temperature dependence above 373 K, which may be explained by diffusional creep. In contrast, passivated samples appeared to deform by thermally activated dislocation glide. The observed activation energies for both mechanisms are considerably lower than those for the bulk material, indicating that concomitant stress relaxation mechanisms are more pronounced in the thin film geometry.

Although it is well known that thin films exhibit mechanical properties very different from those of their bulk counterparts, knowledge of the underlying mechanisms is incomplete. Single-crystalline films have a favorable microstructure for investigating the scaling behavior of mechanical properties. We present a novel experimental route for preparing single-crystalline An films on a compliant polyimide substrate. For such single-crystals, we have developed a synchrotron-based tensile testing technique to measure the isothermal stress-strain curves and average peak widths. The analysis of Lane diffraction patterns as well as a parallel transmission electron microscopy study give new insight in the initial and evolving microstructure of the films. Complex novel deformation mechanisms are found, including a transition of the dominant deformation mechanism from full to partial dislocations in films thinner than 160 nm. The scaling behavior is described in view of the coexistence of different deformation mechanisms where the nucleation stress for single dislocations very likely governs the behavior. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Measurements of the stress–strain response of hairlike gecko setae are presented. These setae have diameters in the micron range and are part of the attachment organs that enable lizards to cling to surfaces. Three test methods were employed: (a) applying tension with a piezoresistive cantilever inside a focused ion beam microscope under vacuum conditions, (b) three-point bending in air using an atomic force microscope, and (c) nanoindentation tests on the circumference of the seta. Elastic moduli were found to depend strongly on the method of testing: Tensile testing in vacuum yielded an elastic modulus of 7.3 ± 1.0 GPa which was roughly five to six times higher than in bending and in nanoindentation tests at ambient conditions. The results are discussed in terms of the anisotropic nanostructure of the setae and humidity effects. They constitute valuable input parameters for optimizing the performance of artificial attachment devices.

The texture, microstructure and mechanical behavior of bulk ultrafine-grained (ufg) Zr fabricated by accumulative roll bonding (ARB) is investigated by electron backscatter diffraction, transmission electron microscopy and mechanical testing. A reasonably homogeneous and equiaxed ufg structure, with a large fraction of high angle boundaries (HABs, ~ 70%), can be obtained in Zr after only two ARB cycles. The average grain size, counting only HABs (Θ > 15°), is 400 nm. (Sub)grain size is equal to 320 nm. The yield stress and UTS values are nearly double those from conventionally processed Zr with only a slight loss of ductility. Optimum processing conditions include large thickness reductions per pass (epsilon similar to 75%), which enhance grain refinement, and a rolling temperature (T ~ 0.3Tm) at which a sufficient number of slip modes are activated, with an absence of significant grain growth. Grain refinement takes place by geometrical thinning and grain subdivision by the formation of geometrically necessary boundaries. The formation of equiaxed grains by geometric dynamic recrystallization is facilitated by enhanced diffusion due to adiabatic heating.

Diffusion of atoms in a crystalline lattice is a thermally activated process that can be strongly accelerated by defects such as grain boundaries or dislocations. When carried by dislocations, this elemental mechanism is known as "pipe diffusion." Pipe diffusion has been used to explain abnormal diffusion, Cottrell atmospheres, and dislocation- precipitate interactions during creep, although this rests more on conjecture than on direct demonstration. The motion of dislocations between silicon nanoprecipitates in an aluminum thin film was recently observed and controlled via in situ transmission electron microscopy. We observed the pipe diffusion phenomenon and measured the diffusivity along a single dislocation line. It is found that dislocations accelerate the diffusion of impurities by almost three orders of magnitude as compared with bulk diffusion.

Measurements of the force required for the pull-off of N polyvinylsiloxane fibrils from glass surfaces reveal that it varies linearly with the total contact perimeter, NS. This finding cannot be rationalized using existing models of adhesion. A new model is introduced which exploits the analogy with rupture of brittle solids; it proposes that fibril detachment under tension is controlled by weakest link defects. The model predicts a power law dependence of the force; i.e., NSn with exponent n varying between 1 and 2. The linear dependence found experimentally arises when the defects are present with broad size dispersion.