Jun.-Prof. Dr. Lola González-García

Conductive polymer composites (CPCs) combine the stretchability of an elastomeric matrix with the electrical conductivity of a metallic filler. The 3D structure of this filler particle network (FPN) and the contact resistances between particles above percolation, key factors in the conductivity, are not well understood. Here, we introduce 3D reconstructions of FPNs of micron-sized spherical silver particles in polydimethylsiloxane from focused ion beam scanning electron microscopy tomography. Analysis of the tomographic images provides the length and number of parallel conductive paths. The results show that the average contact resistance drops five orders of magnitude when increasing the silver loading from 36 vol% to 53 vol%, highlighting its dominating role for macroscopic conductivity rather than network structure. This links to 33% larger average area-equivalent diameters of the contact spots. Diffusional tortuosity, a metric that quantifies flow restriction through narrow contact spots, proves that higher contact forces decrease current flow restrictions and thus, increase overall electrical conductivity. These conclusions are verified using a segregated CPC, and it is found that the addition of 20 vol%
of insulating fillers at a constant silver loading of 30 vol% increases the conductivity 37-fold and decreases the average contact resistance by two orders of magnitude.

Silver microflakes and -spheres are common fillers for electrically conductive screen-printing pastes. Here, we report on the effects of filler shapes and sizes on conductivity, sintering, and recyclability. We printed pastes based on flakes and spheres, treated them at 110 °C to 300 °C, and evaluated the electrical conductivity of the resulting layers. The electrical conductivity of the layers treated at 110 °C was dominated by particle–particle contact resistances; flakes yielded layers that were five times more conductive than sphere-based layers due to differences in the particle–particle contact area. Increasing temperature led to a reduction of the resistivity of all layers through sintering. At 300 °C, prints based on spheres were 4 times more conductive than those from flakes. Tomography of the sintered structures showed that the difference was caused by a lower tortuosity factor for spheres. In a final study, we showed that silver flakes and spheres could be recycled after sintering and reused for a new generation of prints without losing electrical performance. The more porous structure of sintered flakes allowed for higher recycling yields compared to spheres. At 140 °C, 91.6% of the flakes and 69.7% of the spheres were recovered as reusable dispersions.

Silver-coated copper microparticles combine the oxidation resistance of silver with the low cost of copper. They are interesting components for printed conductive structures. We studied whether printed films of such particles can be printed and sintered at low temperatures in air to create highly conductive films and whether it is possible to recover the particles from them for recycling. Pastes containing 1.5 μm to 5 μm spheres and 3 μm flakes with L-ascorbic acid were prepared, screen-printed, and treated at temperatures of 110 °C to 300 °C in air. The bulk resistance of films treated below 160 °C were two orders of magnitude higher than that of bulk copper, ρCu, and limited by particle-particle contact resistances. They were reduced by treating the prints at 160 °C to 250 °C, leading to bulk film resistances down to 41ρCu. We demonstrate that the high mobility of silver enables the formation of necks that bridge the copper cores and reduce resistivity in this temperature window. The sintered prints retained their conductivity for at least 6 months. Treatments at higher temperatures in air were detrimental: resistances increased above 250 °C. These temperatures led to dewetting of the silver coating and fast copper oxidation, resulting in a continuously increasing resistance. In a final study, we demonstrated that films treated below 200 °C can be recycled by recovering the metal powder from the printed conductors and that the powder can be printed again.

Hybrid core–shell nanoparticles with metal cores and conductive polymer shells yield materials that are sinter-free and highly conductive but mechanically weak. Conventional composites of such nanoparticles are electrically insulating. Here, we introduce microscale phase-separated nanocomposites of hybrid gold-PEDOT:PPS particles in insulating poly(vinyl alcohol) (PVA). They combine electrical conductivities of up to 2.1 × 105 S/m at 10 vol % PVA with increased mechanical adhesion on polyethylene terephthalate and glass substrates. We studied the effects of the PVA molecular weight, hydrolyzation degree, and volume fraction. Composites with 10 vol % highly hydrolyzed PVA at a MW of 89–98 kDa had the highest conductivities and stabilities; highly hydrolyzed PVA even increased the conductivity of the hybrid particle layers. We propose the formation of hydrogen bonds between PVA and PEDOT:PSS that lead to demixing and the formation of stable, structured composites. Finally, we demonstrated the inkjet-printability of inks containing PVA in water with viscosities of 1.6–2.0 Pa s at 50.1 s–1 and prepared bending-resistant electrical leads.

Flexible and stretchable electronics require both sensing elements and stretching-insensitive electrical connections. Conductive polymer composites and liquid metals are highly deformable but change their conductivity upon elongation and/or contain rare metals. Solid conductive composites are limited in mechanoelectrical properties and are often combined with macroscopic Kirigami structures, but their use is limited by geometrical restraints. Here, we introduce “Electrofluids”, concentrated conductive particle suspensions with transient particle contacts that flow under shear that bridge the gap between classic solid composites and liquid metals. We show how Carbon Black (CB) forms large agglomerates when using incompatible solvents that reduce the electrical percolation threshold by 1 order of magnitude compared to more compatible solvents, where CB is well-dispersed. We analyze the correlation between stiffness and electrical conductivity to create a figure of merit of first electrofluids. Sealed elastomeric tubes containing different types of electrofluids were characterized under uniaxial tensile strain, and their electrical resistance was monitored. We found a dependency of the piezoresistivity with the solvent compatibility. Electrofluids enable the rational design of sustainable soft electronics components by simple solvent choice and can be used both as sensor and electrode materials, as we demonstrate.

Silver nanowires (AgNW) find use in transparent conductive electrodes with applications in solar cells, touch screens, and wearables. Unprotected AgNW are prone to atmospheric corrosion and lose conductivity over time. Known passivation techniques either require submersion of pre-deposited AgNW in liquid compounds or the modification of AgNW inks prior to deposition, which alters viscosity and complicates deposition. Here, new possibilities for stabilization of pre-deposited AgNW networks without need for submersion are explored. It is demonstrated that AgNW networks can be stabilized either by argon or hydrogen plasma treatment or by solvent vapor annealing with ethanol, methanol, or ethyl acetate. These treatments yielded stable electrical resistance over at least nine weeks, whereas untreated or thermally annealed AgNW layers quickly lost conductivity. The potential of solvent vapor annealing is further explored by demonstrating a new processing technique for stable polymer matrix composites containing AgNW. Co-deposited layers of AgNW with polystyrene microbeads are annealed in ethyl acetate vapor to stabilize the AgNW while at the same time merging polymer beads into a closed film around the AgNW. The resulting composites maintained stable resistance and transmittance for at least seven weeks.

We report the synthesis of AgNP@PEDOT:PSS hybrid conductive particles with silver cores and polythiophene shells that can be used to formulate sinter-free inks for printing electronics. First, Ag nanocrystals capped with the weakly bound ligand aminohexanoic acid (ε-Ahx) are prepared. The ligand shell is exchanged by reacting the dispersion with the polymer ionomer mixture poly(3,4-ethylene dioxythiophene):polystyrene sulfonate (PEDOT:PSS). The particles are characterized by electron microscopy, dynamic light scattering, Z potential, and Raman spectroscopy, confirming the replacement of the ligands on the metal particle surface. The resulting dispersion is colloidally stable as confirmed by DLS. Inks with a solid content of the hybrid particles of 300 mg mL−1 were prepared and deposited on different substrates. The new particles are components for hybrid inks that become electrically conductive without any chemical or thermal post-deposition treatment. We show that silver-based hybrid inks can be deposited on different substrates and possess an average conductivity after 24 h of drying at room temperature of 1.726 × 106 S m−1 ± 0.326 × 106 S m−1, only one order of magnitude lower than elemental silver and within the same order of magnitude as their gold ink counterpart.

We report on the unusual, advantageous ageing of flexible transparent electrodes (FTEs) that were self-assembled from oleylamine-capped gold nanospheres (AuNPs) by direct nanoimprinting of inks with different particle concentrations (cAu = 3 mg mL−1 to 30 mg mL−1). The resulting lines were less than 2.5 μm wide and consisted of disordered particle assemblies. Small-Angle X-ray Scattering confirmed that particle packing did not change with ink concentration. Plasma sintering converted the printed structures into lines with a thin, electrically conductive metal shell and a less conductive hybrid core. We studied the opto-electronic performance directly after plasma sintering and after fourteen days of storage at 22 °C and 55% rH in the dark. The mean optical transmittance [T with combining macron]400–800 in the range from 400 nm to 800 nm increased by up to ≈ 3%, while the sheet resistance Rsh strongly decreased by up to ≈ 82% at all concentrations. We correlated the changes with morphological changes visible in scanning and transmission electron microscopy and identified two sequential ageing stages: (I) post-plasma relaxation effects in and consolidation of the shell, and (II) particle re-organization, de-mixing, coarsening, and densification of the core with plating of Au from the core onto the shell, followed by solid-state de-wetting (ink concentrations cAu < 15 mg mL−1) or stability (cAu ≥ 15 mg mL−1). The plating of Au from the hybrid core improved the FTEs' Figure of Merit FOM = [T with combining macron]400–800·Rsh−1 by up to ≈ 5.8 times and explains the stable value of ≈ 3.3%·Ωsq−1 reached after 7 days of ageing at cAu = 30 mg mL−1.

Hybrid dielectrics were prepared from dispersions of nanoparticles with gold cores (diameters from 2.9 nm to 8.2 nm) and covalently bound thiol-terminated polystyrene shells (5000 Da and 11 000 Da) in toluene. Their microstructure was investigated with small angle X-ray scattering and transmission electron microscopy. The particles arranged in nanodielectric layers with either face-centered cubic or random packing, depending on the ligand length and core diameter. Thin film capacitors were prepared by spin-coating inks on silicon substrates, contacted with sputtered aluminum electrodes, and characterized with impedance spectroscopy between 1 Hz and 1 MHz. The dielectric constants were dominated by polarization at the gold–polystyrene interfaces that we could precisely tune via the core diameter. There was no difference in the dielectric constant between random and supercrystalline particle packings, but the dielectric losses depended on the layer structure. A model that combines Maxwell–Wagner–Sillars theory and percolation theory described the relationship of the specific interfacial area and the dielectric constant quantitatively. The electric breakdown of the nanodielectric layers sensitively depended on particle packing. A highest breakdown field strength of 158.7 MV m−1 was found for the sample with 8.2 nm cores and short ligands that had a face-centered cubic structure. Breakdown apparently is initiated at the microscopic maxima of the electric field that depends on particle packing. The relevance of the results for industrially produced devices was demonstrated on inkjet printed thin film capacitors with an area of 0.79 mm2 on aluminum coated PET foils that retained their capacity of 1.24 ± 0.01 nF@10 kHz during 3000 bending cycles.

We directed the self-assembly of nanoscale colloids via direct nanoimprint lithography to create flexible transparent electrodes (FTEs) with metal line widths below 3 μm in a roll-to-roll-compatible process. Gold nanowires and nanospheres with oleylamine shells were imprinted with soft silicone stamps, arranged into grids, and converted into metal lines in a plasma process. We studied the hierarchical structure and opto-electronic performance of the resulting grids as a function of particle geometry and concentration. The performance in terms of optical transmittance was dominated by the line width. Analysis of cross-sections indicated that plasma sintering only partially removed the insulating ligands and formed lines with thin conductive shells and a non-conductive core. We provide evidence that the self-assembly of high-aspect nanowires can compensate for defects of the stamp and substrate irregularities during imprinting, while spheres cannot. The wire-based electrodes thus outperformed the sphere-based electrodes at ratios of optical transmittance to sheet resistance of up to ≈ 0.9 %·Ωsq-1, while spheres only reached ≈ 0.55 %·Ωsq-1.