Dr. Mariano Laguna Moreno

Recycling of Waste from Electrical and Electronic Equipment (WEEE) is crucial in preventing resource depletion and promoting a circular economy. The increasing fraction of printed and in-mold electronics is particularly challenging. The combinations of polymers and printed metals are difficult to disassemble due to the strong interfaces that are formed to create reliable in-mold devices. The relatively low metal content makes recycling uneconomical and those valuable materials are then lost to landfill or incineration. Separation layers enable design-for-recycling with minimal modifications during the fabrication process, while preserving product performance and reliability. We present a scalable method for preparing polymer separation layers for printed and in-mold electronics. Slot-die coating is used to prepare water-soluble polymer films with a dry thickness of less than 10 μm on commodity polymer substrates. This separation layer improves the bending stability of inkjet- and screen-printed circuits. Furthermore, it is compatible with typical polymer processing methods, such as thermoforming and injection molding. Various methods, including plasma treatment, are presented to ensure adhesion of the modified interfaces. Finally, we investigate the material recovery and demonstrate the release of the integrated metal within a few minutes by dissolving the separation layer in water. This material recovery process can be readily integrated into current WEEE recycling processes.